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TEI: International Conference on Tangible and Embedded Interaction

SponsorSIGCHI
Years2007-
LinkConference Series Home Page
IdentifiersACM-DL - C.TEI - DBLP
DescriptionTEI is dedicated to presenting the latest results in tangible, embedded, and embodied interaction.

The work presented at TEI addresses HCI issues, design, interactive art, user experience, tools and technologies, with a strong focus on how computing can finally bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.

NotesACM DL citation rate: 4.66 (2014)
Edition Year Dates Location Website HCIBib Links Papers Pages
1 2007 02-15 / 02-17 Baton Rouge, Louisiana 50 296
2 2008 02-18 / 02-20 Bonn, Germany 47 267
3 2009 02-18 / 02-20 Cambridge, United Kingdom 73 407
4 2010 01-24 / 01-27 Cambridge, Massachusetts 99 398
5 2011 01-22 / 01-26 Funchal, Portugal 109 452
6 2012 02-19 / 02-22 Kingston, Ontario, Canada 91 413
7 2013 02-10 / 02-13 Barcelona, Spain 88 454
8 2014 02-16 / 02-19 Munich, Germany 78 388
9 2015 01-15 / 01-19 Stanford, California 139 738
10 2016 02-14 / 02-17 Eindhoven, Netherlands 121 793